MediaTek is adding the Dimensity 7200 chipset in their range of offerings to smartphone manufacturers. The new chip boasts new AI imaging features, gaming optimizations, 5G support, and deeply engrained power savings for extended battery life.
The Dimensity 7200 is based on the 4nm TSMC second-generation process found in the Dimensity 9200. It integrates two Arm Cortex-A75 cores at up to 2.8GHz and six Cortex-A510 cores at up to 2.0GHz for seamless multitasking and peak performance in apps. Performance is further optimized thanks to its built-in AI Processing Unit that improves efficiency of AI tasks and AI-fusion processing.
For gaming, its MediaTek HyperEngine 5.0 provides AI-based Variable Rate Shading (VRS) for power savings, CPU and GPU resource optimization for better battery life, and other upgrades for smooth gameplay. Integrated to the chipset is an Arm Mali G610 GPU for faster response times and high frame rates.
The chipset will now support 200MP main cameras and 4K HDR video with its Imagig 765 and 14-bit HDR-ISP. It will also allow you to capture content from two cameras at FullHD while in focus with its all-pixel autofocus. Capturing low-light environments is made easier with the built-in motion compensated noise reduction while its APU now supports AI-Camera enhancements such as real-time portrait beautification.
The company will be supporting 5G modem, WiFi 6E, UFS 3.1 storage, 144Hz, HDR10+, CUVA HDSR, and Dolby HDR on the Dimensity 7200. It will also come with AI SDR-to-HDR video playback and Dual-Link True Wireless Stereo Audio for better entertainment.
The Dimensity 7200-based midrange devices are expected to hit the global market in Q1 2023.
