MediaTek has finally announced their next flagship chipset: the Dimensity 9000. It is the first mobile chip to be built on TSMC’s 4nm process and will be using ARM’s new v9 architecture.
The MediaTek Dimensity 9000 sports a single Ultra-Core Cortex-X2, three Cortex-A710 Super-Cores, and four Cortex-A510 Efficiency Cores. The chipset can also support LPDDR5x RAM that can run up to 7500Mbps. Its GPU is now a ten-core ARM Mali-G710 with a new raytracing SDK using Vulkan and will support 180Hz FullHD+ screens.
Imaging has been improved with an 18-bit HDR-ISP design to allow smartphones to capture HDR videos on three cameras simultaneously and even 320MP photos. Devices with this chipset can support 8K video encoding and decoding and 8K AV1 video playback.
The Dimensity 9000 will come with a 3GPP Release-16 standard technology to amplify sub-6GHz performance for 5G as well as R16 UL Tx Switching for SUL and NR UL-CA-based connections. Other wireless improvements include Bluetooth 5.3 support, WiFi 6E 2×2, and Bluetooth LE Audio-ready technology.
It is expected that the MediaTek Dimensity 9000 will make their first appearance on devices starting late Q1 2022.