MediaTek has officially launched the Dimensity 6000 series aiming to enhance the performance of next generation mainstream 5G devices. The first in the lineup is the Dimensity 6100+ SoC that will support more vivid displays with high framerates, AI-powered cameras, lower power consumption, and more reliable Sub-6 5G connectivity at a reasonable price point.
MediaTek Dimensity 6000 Series
The Dimensity 6100+ comes with a 5G modem that supports 3GPP Release 16 standard with up to 140MHz 2CC 5G carrier aggregation that significantly reduces power consumption with its MediaTek UltraSave 3.0+ technology.
The SoC comes with two Arm Cortex-A76 big cores and six Arm Cortex-A55 efficiency cores for improved performance and includes support for AI-powered cameras and 10-bit displays. Enhancements for the chip also include support for:
- Up to 108MP Non-ZSL cameras
- Up to 2K 30fps video capture
- AI Bokeh, AI-Color Technology
- 90Hz to 120Hz display support
MediaTek’s 5G portfolio have expanded to different price tiers like the Dimenisty 9000 series for flagship devices and tablets, Dimensity 8000 family for premium smartphones, Dimensity 7000 for high-tech devices, while the Dimensity 6000 series is positioned for more affordable mainstream devices.
The first smartphones featuring the Dimensity 6100+ chipset will hit the market in the 3rd quarter of 2023.
