MediaTek has officially launched the Dimensity 6000 series aiming to enhance the performance of next generation mainstream 5G devices. The first in the lineup is the Dimensity 6100+ SoC that will support more vivid displays with high framerates, AI-powered cameras, lower power consumption, and more reliable Sub-6 5G connectivity at a reasonable price point.
The Dimensity 6100+ comes with a 5G modem that supports 3GPP Release 16 standard with up to 140MHz 2CC 5G carrier aggregation that significantly reduces power consumption with its MediaTek UltraSave 3.0+ technology.
The SoC comes with two Arm Cortex-A76 big cores and six Arm Cortex-A55 efficiency cores for improved performance and includes support for AI-powered cameras and 10-bit displays. Enhancements for the chip also include support for:
MediaTek’s 5G portfolio have expanded to different price tiers like the Dimenisty 9000 series for flagship devices and tablets, Dimensity 8000 family for premium smartphones, Dimensity 7000 for high-tech devices, while the Dimensity 6000 series is positioned for more affordable mainstream devices.
The first smartphones featuring the Dimensity 6100+ chipset will hit the market in the 3rd quarter of 2023.
